The application of plasma technology is intended to achieve different goals.
Removal of separating layers
As preparation for subsequent processes such as bonding, coating, etc., plasma technology is used to pre-treat the surface in such a way that unwanted source materials and dust particles are removed. Plasma technology makes it possible to further process the materials immediately after plasma cleaning.
Increase of surface tension
The surface of plastics, metals and other materials is modified through the use of plasma technology in such a way that the surface tension is increased to the desired level, significantly improving wettability.
Plasma cleaning
Plasma treatment and plasma cleaning optimally prepare surfaces on plastics, metals and many other materials for subsequent processes such as bonding, coating and various other processes. The material surfaces are gently cleaned of unwanted source materials and even the smallest dust particles. The reliable plasma fine cleaning removes any additives, hydrocarbons, mold release agents and plasticizers from plastic surfaces. The plasma-treated materials can be further processed immediately after plasma cleaning.
Plasma activation
Plasma activation modifies surfaces of plastics, metals and various other materials to increase the surface tension required for subsequent processes such as bonding and printing. Plasma activation significantly improves wettability on material surfaces.
Plasma functionalization
Functionalization with atmospheric pressure plasma enables a significant improvement in surface energy on thermally sensitive surfaces. Thus, polymer surfaces can be bonded, printed and coated without problems in subsequent processes.
Passivation by plasma pretreatment
Plasma passivation specifically protects surfaces on a metallic material from corrosion. The passivation layer created improves corrosion protection and slows down corrosion.
Reduction through plasma pretreatment
Plasma pretreatment can reduce the surface roughness of insulating and metallic coatings without affecting their physical properties.